Figure 7
From: Extremely large area (88 mm × 88 mm) superconducting integrated circuit (ELASIC)
ELASIC packaging process flow (A) Copper plate (1.4 lb). (B) ELASIC attached to copper plate. Thermal grease and silver paint were used to attach ELASIC to copper plate. (C) Placement of PCB, wirebonds and ardent connectors interface on cryocooler motherboard. (D) Mount assembly to cryo-cooler for thermal cycling.
