Table 1 Specific thermal resistances of 4H-SiC, die-attach solder, and copper lead frame, calculated from the typical thickness of each layer and the values for the thermal conductivity.

Thickness

\((\mathrm{mm})\)

Thermal Conductivity \(k\)

(\(\mathrm{W}/\mathrm{ mm}\, ^\circ \mathrm{C}\))

Specific thermal resistance \({R}_{sp-th}\)

(\(^\circ \mathrm{C}{\, \mathrm{mm}}^{2}/\mathrm{W}\))