Figure 10 | Scientific Reports

Figure 10

From: Effect of CoSn3 nanocrystals on Sn3Ag plating for electronic packaging

Figure 10The alternative text for this image may have been generated using AI.

SEM images of solder joint after reflow (A) solder joint with 0.3 wt% CoSn3 Ns(B) interface of the solder joint with 0.3 wt% CoSn3 Ns (C) Faceted Cu6Sn5 IMC shape (D) Faceted Cu6Sn5 IMC shape (E) solder joint without CoSn3 Ns (F) interface of the solder joint without (G,H) Scalloped Cu6Sn5 (I) EDX mapping of solder joint with/without CoSn3 Ns (J) XRD results of solder joint with/without CoSn3 Ns.

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