Table 2 The effect of DAMP concentration on the corrosion rate and protection efficiency for copper in 1.0 M HCl and 1.0 M H2SO4.

From: Chemical, electrochemical, and quantum investigation into the use of an organophosphorus derivative to inhibit copper corrosion in acidic environments

DAMP conc. (ppm)

CR (mg cm-2 h-1) × 10–5

EW %

1.0 M HCl

1.0 M H2SO4

1.0 M HCl

1.0 M H2SO4

Blank

10.50 ± 0.25

2.92 ± 0.16

–

–

20

6.59 ± 0.21

1.94 ± 0.12

37.2

33.5

40

6.18 ± 0.19

1.81 ± 0.10

41.1

38.0

60

5.76 ± 0.18

1.46 ± 0.17

45.1

50.0

80

5.55 ± 0.19

1.39 ± 0.17

47.1

52.3

100

4.86 ± 0.17

1.18 ± 0.19

53.7

59.5

120

2.71 ± 0.13

1.04 ± 0.09

74.2

64.2

140

2.36 ± 0.15

6.94 ± 0.24

77.5

76.1

160

1.18 ± 0.14

6.25 ± 0.26

88.7

78.5

180

0.347 ± 0.02

0.139 ± 0.11

96.6

95.2

200

0.417 ± 0.01

0.146 ± 0.11

96.0

95.0

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