Figure 2

Fabrication process of the sensing chip. A microscopic image of the fabricated chip with views from (a) top, (b) side and (c) bottom. The orange arrows point to scribe trenches along the [110] direction of the wafer, for dummy separation in the packaging step. Schematic representation of the process: (d) resistive structure and (e) insulation layer patterning, (f) mini bump plating, and deep silicon etching on (g) front side and (h) back side.