Figure 2 | Scientific Reports

Figure 2

From: Additively manufactured, long, serpentine submillimeter channels by combining binder jet printing and liquid-phase sintering

Figure 2

Step-by-step illustration of the proposed process steps for device fabrication using binder jet printing and diffusion bonding: (a) binder jet printing of three green parts—two cover plates and one core, (b) binder phase curing, (c, d) removal of loose powder, (e) binder phase burn-out, (e, f) full sintering and joining of the three parts to form the submillimeter channel device, (g) welding of fluidic interconnects.

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