Table 1 Dimensions of the submillimeter channel devices before and after sintering.

From: Additively manufactured, long, serpentine submillimeter channels by combining binder jet printing and liquid-phase sintering

 

Designed

Printed

Sintering condition

1130 °C, 6 h

1135 °C, 6 h

1135 °C, 12 h

1140 °C, 6 h

Device width

19.00

19.10

15.74

(17.6%)

15.65

(18.1%)

15.52

(18.7%)

15.56

(18.5%)

Device length

29.50

29.54

24.09

(18.4%)

23.88

(19.2%)

23.87

(19.2%)

23.71

(19.7%)

Device thickness

9.50

9.75

7.82

(19.8%)

7.56

(22.4%)

7.57

(22.3%)

7.66

(21.4%)

Channel height

2.00

2.11

1.63 ± 0.035

(22.7%)

1.53 ± 0.017

(28.9%)

1.75 ± 0.016

(17.1%)

1.50 ± 0.015

(27.5%)

Channel width

0.60

0.62

0.51 ± 0.093

(17.7%)

0.50 ± 0.045

(19.4%)

0.54 ± 0.018

(12.9%)

0.50 ± 0.043

(19.4%)

  1. Measured from the cross-sectional SEM images (see Fig. 6). Unit = mm. Percentage in parenthesis indicates dimensional shrinkage.
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