Fig. 4 | Scientific Reports

Fig. 4

From: Novel design and implementation of 3d packaged wideband bandpass filters

Fig. 4

Showing the modeling configuration of multilayers of the proposed BPF: (a) illustrating the cross-sectional view of the proposed BPF that demonstrates the multilayers from layer one to layer 7, the vias that connect the top layer (L1) to the bottom layer seven (L7), and the air cavity. (b) demonstrating the backside DGS layer for the HPF (L1), (c) showing the front circuit of the HPF (L2), (d) showing the top layer (L3), (e) showing the bottom layer (L4), (f) showing the ground layer (L5), and (g) illustrating the LPF circuit situated (L6).

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