Fig. 1
From: Establishing an end-to-end workflow for SNSPD fabrication and characterization
Deposition-and-characterization cycle of superconducting films. (a) Material sources in the main sputtering chamber loaded with independent DC (direct-current) controlled Nb target and RF (radio-frequency) controlled Ti target. (b) Typical X-ray diffraction pattern of the deposited NbTiN films. (c) X-ray reflectivity spectrum (black line) of a representative NbTiN film. For the film in (c), the best-fit curve (blue line) yielded a thickness of 7.0 nm, mass density of 7.8 ± 0.2 g/cm3, and roughness of 0.1 nm. (d) The temperature-dependent sheet resistance of a representative NbTiN film obtained from DC transport measurements and used to determine its critical temperature. The film being measured was deposited at a working pressure of 2.5 mTorr with a N2 flow rate of 3.5 sccm and had a thickness of 7 nm.
