Fig. 3
From: AI-driven point cloud framework for predicting solder joint reliability using 3D FEA data
Creep strain in solder interconnects (a) First level (AuSn) (b) First level (SAC305) (c) Second level (SAC305).
Fig. 3 | Scientific Reports
From: AI-driven point cloud framework for predicting solder joint reliability using 3D FEA data
Creep strain in solder interconnects (a) First level (AuSn) (b) First level (SAC305) (c) Second level (SAC305).
