Table 7 Process conditions and weight loss of material obtained in lapping using different metallic and non-metallic tools.
Tool type | Workpiece material | Abrasive Type | Process parameters | Processing time t [min] | Weight loss of material after a processing time t Δm [mg] | |
|---|---|---|---|---|---|---|
Max rotational speed of a tool nt [min−1] | Max unit pressure p [kPa] | |||||
Segmented polyamide disc printed by SLS - under investigation in the article | Al2O3 | Suspension with mixed SD 28/20 and D107 diamond grains | 120 | 12 | 120 | 4041 |
UV-curable resin bond diamond lapping plate [32] | Al2O3 | Diamond grains with an average size of 15 μm fixed in the resin bond | 50 | 1.77 | 60 | 122 |
Conventional disc made of cast iron [32] | Al2O3 | Suspension containing diamond grains with an average size of 15 μm | 50 | 1.77 | 60 | 185 |
Conventional disc made of cast iron [33] | Tellurium copper | Paraffin and oil-based slurry with black silicon carbide grains (98 C F500) | 64 | 3.79 | 90 | 932 |
Electroplated diamond disc with the nickel plating ratio Tb = 35% [5] | Al2O3 | D107 diamond grains fixed in the thinnest nickel bond | 60 | 14 | 18 | 523 |
Electroplated diamond disc with the nickel plating ratio Tb = 50% [5] | Al2O3 | D107 diamond grains fixed in the nickel bond of the medium thickness | 60 | 14 | 18 | 631 |
Electroplated diamond disc with the nickel plating ratio Tb = 65% [5] | Al2O3 | D107 diamond grains fixed in the thickest nickel bond | 60 | 14 | 18 | 741 |
