Table 1 Bonding process parameters and thermal cycles for samples involved in this study.

From: Study on pore features in sintered die-attach microstructures based on machine learning

Samples

Temperature

Pressure

Thermal cycles

#1

250 °C

20 MPa

1500

#2

300 °C

10 MPa

1500

#3

300 °C

10 MPa

500

#4

300 °C

20 MPa

1500

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