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Strain-tunable inter-valley scattering defines universal mobility enhancement in n- and p-type 2D TMDs
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  • Published: 31 March 2026

Strain-tunable inter-valley scattering defines universal mobility enhancement in n- and p-type 2D TMDs

  • Sheikh Mohd Ta-Seen Afrid1,2,3,
  • He Lin Zhao1,2,3,
  • Arend M. van der Zande2,3,4,5,6 &
  • …
  • Shaloo Rakheja1,2,3 

npj 2D Materials and Applications , Article number:  (2026) Cite this article

We are providing an unedited version of this manuscript to give early access to its findings. Before final publication, the manuscript will undergo further editing. Please note there may be errors present which affect the content, and all legal disclaimers apply.

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  • Materials science
  • Nanoscience and technology
  • Physics

Abstract

Strain fundamentally alters carrier transport in semiconductors by modifying their band structure and scattering pathways. In transition-metal dichalcogenides (TMDs), an emerging class of 2D semiconductors, we show that mobility modulation under biaxial strain is dictated by changes in inter-valley scattering rather than effective mass renormalization as in bulk silicon. Using a multiscale full-band transport framework that incorporates both intrinsic phonon, extrinsic impurity, and dielectric scattering, we find that tensile strain enhances n-type mobility through K–Q valley separation, while compressive strain improves p-type mobility via Γ–K decoupling. The tuning rates calculated from our full-band model far exceed those achieved by strain engineering in silicon. Both relaxed and strain-modulated carrier mobilities align quantitatively with experimentally verified measurements and are valid across a wide range of practical FET configurations. The enhancement remains robust across variations in temperature, carrier density, impurity level, and dielectric environment. Our results highlight the pivotal role of strain in improving the reliability and performance of 2D TMD-based electronics.

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Data availability

The primary data supporting the conclusions of this work are included in the main text and the Supplementary Information. Any additional data can be obtained from the authors upon reasonable request.

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Acknowledgements

This work was supported by the National Science Foundation (NSF) through the University of Illinois Urbana–Champaign Materials Research Science and Engineering Center under Award DMR-2309037. The authors acknowledge the use of facilities and instrumentation supported by NSF through the University of Illinois Materials Research Science and Engineering Center DMR-2309037. The authors also acknowledge partial support by the NSF through the Center for Advanced Semiconductor Chips with Accelerated Performance Industry-University Cooperative Research Center under NSF Cooperative Agreement No. EEC-2231625.

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Authors and Affiliations

  1. Department of Electrical and Computer Engineering, University of Illinois Urbana-Champaign, Urbana, IL, USA

    Sheikh Mohd Ta-Seen Afrid, He Lin Zhao & Shaloo Rakheja

  2. Holonyak Micro and Nanotechnology Laboratory, University of Illinois Urbana-Champaign, Urbana, IL, USA

    Sheikh Mohd Ta-Seen Afrid, He Lin Zhao, Arend M. van der Zande & Shaloo Rakheja

  3. Grainger College of Engineering, University of Illinois Urbana-Champaign, Urbana, IL, USA

    Sheikh Mohd Ta-Seen Afrid, He Lin Zhao, Arend M. van der Zande & Shaloo Rakheja

  4. Department of Materials Science and Engineering, University of Illinois Urbana-Champaign, Urbana, IL, USA

    Arend M. van der Zande

  5. Department of Mechanical Science and Engineering, University of Illinois Urbana-Champaign, Urbana, IL, USA

    Arend M. van der Zande

  6. Materials Research Laboratory, University of Illinois Urbana-Champaign, Urbana, IL, USA

    Arend M. van der Zande

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Contributions

S.M.T.S.A. performed all calculations, analyzed the results, and wrote the manuscript. H.L.Z. helped interpret the results and contributed to the manuscript. A.M.v.d.Z. guided the direction of the research, provided critical feedback, and contributed to the manuscript. S.R. supervised the entire project, advised on the research strategy, provided scientific guidance, and contributed to the manuscript. All authors reviewed and approved the manuscript.

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Correspondence to Shaloo Rakheja.

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Afrid, S.M.TS., Zhao, H.L., van der Zande, A.M. et al. Strain-tunable inter-valley scattering defines universal mobility enhancement in n- and p-type 2D TMDs. npj 2D Mater Appl (2026). https://doi.org/10.1038/s41699-026-00689-y

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  • Received: 04 November 2025

  • Accepted: 17 March 2026

  • Published: 31 March 2026

  • DOI: https://doi.org/10.1038/s41699-026-00689-y

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