Abstract
Transition metal dichalcogenides are a potential alternative to silicon and could be used to create transistors with a contacted gate pitch below 40 nm as required by the ångström-node transistor technology. However, it remains challenging to maintain an ohmic contact when the contact length is reduced to less than 20 nm. Here we show that crystalline semi-metallic antimony contacts can be epitaxially grown on molybdenum disulfide (MoS2) by molecular beam epitaxy, creating ohmic contacts with a resistance of 98 Ω µm at a contact length of 18 nm. We use the contacts to build scaled field-effect transistors with a contacted gate pitch of 40 nm with drive currents of 0.85 mA µm−1, 0.95 mA µm−1 and 1.08 mA µm−1 for monolayer, bilayer and trilayer MoS2 channels, respectively. Statistical analysis of transistor arrays confirms that the crystalline antimony contacts are reproducible and stable.
This is a preview of subscription content, access via your institution
Access options
Access Nature and 54 other Nature Portfolio journals
Get Nature+, our best-value online-access subscription
$32.99 / 30 days
cancel any time
Subscribe to this journal
Receive 12 digital issues and online access to articles
$119.00 per year
only $9.92 per issue
Buy this article
- Purchase on SpringerLink
- Instant access to the full article PDF.
USD 39.95
Prices may be subject to local taxes which are calculated during checkout




Similar content being viewed by others
Data availability
The data that support the findings of this study are available from the corresponding authors on reasonable request.
Change history
13 January 2026
A Correction to this paper has been published: https://doi.org/10.1038/s41928-026-01563-x
References
Cao, W. et al. The future transistors. Nature 620, 501–515 (2023).
Wu, F. et al. Vertical MoS2 transistors with sub-1-nm gate lengths. Nature 603, 259–264 (2022).
Desai, S. B. et al. MoS2 transistors with 1-nanometer gate lengths. Science 354, 99–102 (2016).
Liu, Y. et al. Promises and prospects of two-dimensional transistors. Nature 591, 43–53 (2021).
Wu, W.-C. et al. Scaled contact length with low contact resistance in monolayer 2D channel transistors. In Proc. 2023 IEEE Symposium on VLSI Technology and Circuits 1–2 (IEEE, 2023).
Chang, C.-H. et al. Critical process features enabling aggressive contacted gate pitch scaling for 3nm CMOS technology and beyond. In 2022 International Electron Devices Meeting 27.1.1–27.1.4 (IEEE, 2022).
International Roadmap for Devices and Systems (IEEE, 2022); https://irds.ieee.org/editions/2022/
Wang, S. et al. Two-dimensional devices and integration towards the silicon lines. Nat. Mater. 21, 1225–1239 (2022).
Qiu, H. et al. Two-dimensional materials for future information technology: status and prospects. Sci. China Inf. Sci. 67, 160400 (2024).
Wu, P. et al. 2D materials for logic device scaling. Nat. Mater. 23, 23–25 (2024).
Li, W. et al. Uniform and ultrathin high-κ gate dielectrics for two-dimensional electronic devices. Nat. Electron. 2, 563–571 (2019).
Li, W. et al. Approaching the quantum limit in two-dimensional semiconductor contacts. Nature 613, 274–279 (2023).
Shen, P. C. et al. Ultralow contact resistance between semimetal and monolayer semiconductors. Nature 593, 211–217 (2021).
Fan, D. et al. Two-dimensional semiconductor integrated circuits operating at gigahertz frequencies. Nat. Electron. 6, 879–887 (2023).
Jiang, J. et al. Ballistic two-dimensional InSe transistors. Nature 616, 470–475 (2023).
Penumatcha, A. et al. High mobility TMD NMOS and PMOS transistors and GAA architecture for ultimate CMOS scaling. In Proc. 2023 International Electron Devices Meeting 1–4 (IEEE, 2023).
Cheng, Z. et al. Immunity to contact scaling in MoS2 transistors using in situ edge contacts. Nano Lett. 19, 5077–5085 (2019).
English, C. D. et al. Improved contacts to MoS2 transistors by ultra-high vacuum metal deposition. Nano Lett. 16, 3824–3830 (2016).
Kumar, A. et al. Sub-200 Ω·µm alloyed contacts to synthetic monolayer MoS2. In Proc. 2021 IEEE International Electron Devices Meeting 7.3.1–7.3.4 (IEEE, 2021).
Jiang, J. et al. Yttrium-doping-induced metallization of molybdenum disulfide for ohmic contacts in two-dimensional transistors. Nat. Electron. 7, 545–556 (2024).
Schulman, D. S. et al. Contact engineering for 2D materials and devices. Chem. Soc. Rev. 47, 3037–3058 (2018).
Zeng, S., Liu, C. & Zhou, P. Transistor engineering based on 2D materials in the post-silicon era. Nat. Rev. Electric. Eng. 1, 335–348 (2024).
Wang, Y. et al. Making clean electrical contacts on 2D transition metal dichalcogenides. Nat. Rev. Phys. 4, 101–112 (2022).
Liu, Y. et al. Approaching the Schottky-Mott limit in van der Waals metal-semiconductor junctions. Nature 557, 696–700 (2018).
Wang, Y. et al. Van der Waals contacts between three-dimensional metals and two-dimensional semiconductors. Nature 568, 70–74 (2019).
Wang, Y. et al. P-type electrical contacts for 2D transition-metal dichalcogenides. Nature 610, 61–66 (2022).
Chou, A.-S. et al. High on-state current in chemical vapor deposited monolayer MoS2 nFETs with Sn ohmic contacts. IEEE Electron Device Lett. 42, 272–275 (2020).
Arutchelvan, G. et al. From the metal to the channel: a study of carrier injection through the metal/2D MoS2 interface. Nanoscale 9, 10869–10879 (2017).
Smets, Q. et al. Ultra-scaled MOCVD MoS2 MOSFETs with 42nm contact pitch and 250µA/µm drain current. In Proc. 2019 IEEE International Electron Devices Meeting 23.2.1–23.2.4 (IEEE, 2019).
Li, X. et al. One-dimensional semimetal contacts to two-dimensional semiconductors. Nat. Commun. 14, 111 (2023).
Cheng, Z. et al. How to report and benchmark emerging field-effect transistors. Nat. Electron. 5, 416–423 (2022).
Li, T. et al. Epitaxial growth of wafer-scale molybdenum disulfide semiconductor single crystals on sapphire. Nat. Nanotechnol. 16, 1201–1207 (2021).
Cho, A. Y. et al. Molecular beam epitaxy. Prog. Solid State Chem. 10, 157–191 (1975).
Chen, C. et al. Growth of single-crystal black phosphorus and its alloy films through sustained feedstock release. Nat. Mater. 22, 717–724 (2023).
Schranghamer, T. F. et al. Ultrascaled contacts to monolayer MoS2 field effect transistors. Nano Lett. 23, 3426–3434 (2023).
Guo, Y. et al. Soft-lock drawing of super-aligned carbon nanotube bundles for nanometre electrical contacts. Nat. Nanotechnol. 17, 278–284 (2022).
Chou, A.-S. et al. Status and performance of integration modules toward scaled CMOS with transition metal dichalcogenide channel. In Proc. 2023 International Electron Devices Meeting 1–4 (IEEE, 2023).
Akinwande, D. et al. The quantum limits of contact resistance and ballistic transport in 2D transistors. Nat. Electron. 8, 96–98 (2025).
Arutchelvan, G. et al. Impact of device scaling on the electrical properties of MoS2 field-effect transistors. Sci. Rep. 11, 6610 (2021).
McClellan, C. J. et al. High current density in monolayer MoS2 doped by AlOx. ACS Nano 15, 1587–1596 (2021).
Breil, N. et al. Contact cavity shaping and selective SiGe:B low-temperature epitaxy process solution for sub 10−9 Ω.cm2 contact resistivity in nonplanar FETs. In Proc. 2023 IEEE Symposium on VLSI Technology and Circuits 1–2 (IEEE, 2023).
Wu, W.-C. et al. Comprehensive study of contact length scaling down to 12 nm with monolayer MoS2 channel transistors. IEEE Trans. Electron. Dev. 70, 6680–6686 (2023).
Ieong, M. et al. Transistor scaling with novel materials. Mater. Today 9, 26–31 (2006).
Mondal, A. et al. Low Ohmic contact resistance and high on/off ratio in transition metal dichalcogenides field-effect transistors via residue-free transfer. Nat. Nanotechnol. 19, 34–43 (2024).
Liu, L. et al. Uniform nucleation and epitaxy of bilayer molybdenum disulfide on sapphire. Nature 605, 69–75 (2022).
Wang, Q. et al. Layer-by-layer epitaxy of multi-layer MoS2 wafers. Natl Sci. Rev. 9, nwac077 (2022).
Auth, C. et al. A 10nm high performance and low-power CMOS technology featuring 3rd generation FinFET transistors, self-aligned quad patterning, contact over active gate and cobalt local interconnects. In Proc. 2017 IEEE International Electron Devices Meeting 29.1.1–29.1.4 (IEEE, 2017).
Natarajan, S. et al. A 14nm logic technology featuring 2nd-generation FinFet, air-gapped interconnects, self-aligned double patterning and a 0.0588 µm2 SRAM cell size. In Proc. 2014 IEEE International Electron Devices Meeting 3.7.1–3.7.3 (IEEE, 2014).
Xie, R. et al. A 7nm FinFET technology featuring EUV patterning and dual strained high mobility channels. In Proc. 2016 IEEE International Electron Devices Meeting 2.7.1–2.7.4 (IEEE, 2016).
Cao, Q. et al. Carbon nanotube transistors scaled to a 40-nanometer footprint. Science 356, 1369–1372 (2017).
Sarkar, D. et al. A subthermionic tunnel field-effect transistor with an atomically thin channel. Nature 526, 91–95 (2015).
Si, M. et al. Steep-slope hysteresis-free negative capacitance MoS2 transistors. Nat. Nanotechnol. 13, 24–28 (2018).
Wang, X. et al. Van der Waals negative capacitance transistors. Nat. Commun. 10, 3037 (2019).
Qiu, C. et al. Dirac-source field-effect transistors as energy-efficient, high-performance electronic switches. Science 361, 387–392 (2018).
Liu, M. et al. Two-dimensional cold electron transport for steep-slope transistors. ACS Nano 15, 5762–5772 (2021).
Lin, Y. et al. Scaling aligned carbon nanotube transistors to a sub-10 nm node. Nat. Electron. 6, 506–515 (2023).
Park, J. et al. Highly manufacturable self-aligned direct backside contact (SA-DBC) and backside gate contact (BGC) for 3-dimensional stacked FET at 48nm gate pitch. In Proc. 2024 IEEE Symposium on VLSI Technology and Circuits 1–2 (IEEE, 2024).
Mortelmans, W. et al. Record performance in GAA 2D NMOS and PMOS using monolayer MoS2 and WSe2 with scaled contact and gate length. In Proc. 2024 IEEE Symposium on VLSI Technology and Circuits 1–2 (IEEE, 2024).
Zhu, J. et al. Design–technology co-optimization for 2D electronics. Nat. Electron. 6, 803–804 (2023).
Liu, L. et al. Homoepitaxial growth of large-area rhombohedral-stacked MoS2. Nat. Mater. 24, 1195–1202 (2025).
Blöchl, P. E. et al. Projector augmented-wave method. Phys. Rev. B 50, 17953–17979 (1994).
Perdew, J. P. et al. Generalized gradient approximation made simple. Phys. Rev. Lett. 77, 3865–3868 (1996).
Kresse, G. et al. Efficient iterative schemes for ab initio total-energy calculations using a plane-wave basis set. Phys. Rev. B 54, 11169–11186 (1996).
Grimme, S. et al. Effect of the damping function in dispersion corrected density functional theory. J. Comput. Chem. 32, 1456–1465 (2011).
Sanville, E. et al. Improved grid-based algorithm for Bader charge allocation. J. Comput. Chem. 28, 899–908 (2007).
Acknowledgements
This work was supported by the National Key R&D Program of China (grant nos. 2022YFB4400100, 2023YFF1500500, 2022YFA1402500 and 2021YFA0715600), the National Natural Science Foundation of China (grant nos. T2221003, T2322014, U24A20295, 62304101, 62322408, 62341408, 62204113, 62204124, 62271245, 92164102, 92464303), the Leading-Edge Technology Program of Jiangsu Natural Science Foundation (grant nos. BK20232024, BK20232001), the Jiangsu Province Key R&D Program (grant no. BE2023009-3), the Natural Science Foundation of Jiangsu Province (grant nos. BK20230776, BK20220773, BG2024017), the Fundamental Research Funds for the Central Universities (grant no. 0483014380001), the Fundamental Research Funds for the Central Universities, China, Xiaomi Foundation, Key Laboratory of Advanced Photonic and Electronic Materials, and Collaborative Innovation Center of Solid-State Lighting and Energy-Saving Electronics. We thank the Jiangnan Graphene Research Institute and the Sixth Element Semiconductor (Changzhou) Co. Ltd for assistance with characterization. We also express sincere gratitude to the Interdisciplinary Research Center for Future Intelligent Chips (Chip-X) funded by Yachen Foundation for invaluable support. X.W. acknowledges the support by the New Cornerstone Science Foundation through the XPLORER PRIZE.
Author information
Authors and Affiliations
Contributions
X.W. conceived of and supervised the project. W.L. and X.W. conceived of the idea and designed the experiments. W.L., M.D. and G.X. contributed to transistor fabrication, measurements and data analysis with assistance from C.Z., Z.Y., D.F., H.Q., X.T., N.Z., H.S. and Y.G. F.H. and J.L. performed the transmission electron microscopy and data analysis. W.S. and Y.N. performed XRD and data analysis. X.G., L.M. and J.W. performed the DFT calculations. L.L., X.Z. and T.L. performed chemical-vapour-deposition growth of MoS2. C.Z., J.X., W.G., Y.S., L.T. and J.-B.X. contributed to discussions and data analysis. W.L., M.D. and X.W. co-wrote the paper with input from other authors. All authors discussed the results and commented on the paper.
Corresponding authors
Ethics declarations
Competing interests
The authors declare no competing interests.
Peer review
Peer review information
Nature Electronics thanks Chandan Biswas and the other, anonymous, reviewer(s) for their contribution to the peer review of this work.
Additional information
Publisher’s note Springer Nature remains neutral with regard to jurisdictional claims in published maps and institutional affiliations.
Supplementary information
Supplementary Information (download PDF )
Supplementary Figs. 1–22.
Rights and permissions
Springer Nature or its licensor (e.g. a society or other partner) holds exclusive rights to this article under a publishing agreement with the author(s) or other rightsholder(s); author self-archiving of the accepted manuscript version of this article is solely governed by the terms of such publishing agreement and applicable law.
About this article
Cite this article
Du, M., Li, W., Xiong, G. et al. Scaled crystalline antimony ohmic contacts for two-dimensional transistors. Nat Electron 8, 1191–1200 (2025). https://doi.org/10.1038/s41928-025-01500-4
Received:
Accepted:
Published:
Version of record:
Issue date:
DOI: https://doi.org/10.1038/s41928-025-01500-4
This article is cited by
-
Towards 1-nm-node electronics with two-dimensional transistors
Nature Electronics (2025)


