A three-dimensional dynamic random-access memory (DRAM) architecture that uses oxide-semiconductor channel transistors offers a route to high-density, low-power memory.
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References
Kim, S. K. & Popovici, M. MRS Bull. 43, 334–339 (2018).
Han, J.-W. et al. In IEEE Symposium on VLSI Technology and Circuits https://doi.org/10.23919/VLSITechnologyandCir57934.2023.10185290 (IEEE, 2023).
Belmonte, A. et al. In International Electron Devices Meeting https://doi.org/10.1109/IEDM13553.2020.9371900 (IEEE, 2020).
Duan, X. et al. IEEE Trans. Electron Devices 69, 2196–2202 (2022).
Ye, H. et al. In IEEE International Electron Devices Meeting https://doi.org/10.1109/IEDM13553.2020.9371981 (IEEE, 2020).
Jun, H. et al. In IEEE International Memory Workshop https://doi.org/10.1109/IMW.2017.7939084 (IEEE, 2017).
Okajima, M. et al. Highly stackable oxide-semiconductor channel transistor technology for future high-density and low-power 3D DRAM. In Proc. 2025 IEEE International Electron Devices Meeting (IEEE, 2025); https://www.ieee-iedm.org/
Nomura, K. et al. Nature 432, 488–492 (2004).
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Song, T., Khan, A.I. 3D DRAM with stacked oxide-semiconductor channel transistors. Nat Electron 8, 1132–1133 (2025). https://doi.org/10.1038/s41928-025-01521-z
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DOI: https://doi.org/10.1038/s41928-025-01521-z