Fig. 4: Thermal performance of the nanophotonic structure under various external conditions. | Communications Materials

Fig. 4: Thermal performance of the nanophotonic structure under various external conditions.

From: Continuously variable emission for mechanical deformation induced radiative cooling

Fig. 4

a Schematic drawing of the thermal characterization setup used in the thermal performance analysis. Calculated net cooling power of the reconfigurable nanophotonic structure at different strains as a function of its own temperature at nighttime and daytime under 0.5 sun (0.5 ×  AM 1.5 illumination) and 0.9 sun (0.9 ×  AM 1.5 illumination) with (b) or without (c) polyethylene (PE) convection shield. Solid curve and dashed curve represent the nanophotonic structure are under 0% strain and 120% strain, respectively. The inset depicts the schematic of the thermal characterization setup under closed environment (b) and open to ambient (c).

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