Fig. 1: Analysis of slip band and coupled thermo-mechanical responses during cryogenic tensile deformation.
From: Cryogenic spatiotemporal characteristics and microevolution of 316LN discontinuous plastic flow
a Engineering stress‒strain and temperatures of the Top, Middle, and Bottom positions (Supplementary Fig. 4f) with the time curve during the tensile process. b Temperature fluctuations caused by the slip band (8074–8081 s) and reconstructed via the FEA method (Supplementary Fig. 4d). c Digital εyy strain cloud maps at two moments A (8073.5 s) before and B (8074 s) after the slip band occurs in Fig. 1d. d Engineering stress‒strain curves and temperatures over time (8000–8150 s). Δt1, Δt2, and Δt3 are, respectively, the time intervals from when the mechanical sensor detects the stress drop to when the temperature rise is detected by the thermometers at the Top, Middle, and Bottom positions. e Three types of Δεyy local images of the slip band throughout the entire tensile process.
