Solid-state cooling technology based on electrocaloric materials shows promising potential for addressing electronic overheating challenges. Here, the authors employ two-dimensional polyamide to enhance the electrocaloric cooling performance by reducing intermolecular interactions and facilitating electrocaloric phase transitions thereby, offering insights into the application of spatially confined materials in flexible electronics.
- Fang Wang
- Zhong-Ye Wang
- Qun-Dong Shen
