Here, the authors report a transfer printing method of wafer-scale dielectric layers and metallic electrodes pre-deposited on mica substrates without the need of sacrifice buffer layers, enabling the fabrication of high-performance 2D MoS2 transistors and encapsulated devices based on air-sensitive black phosphorus with one-month stability.
- Yuyu He
- Zunxian Lv
- Jinxiong Wu
