Polyimide aerogel (PIA) was used to synthesize low-dielectric-constant polyimide composite films. Unlike silica aerogel composites, the polyimide aerogel composite films were synthesized solely based on polyimide. The films maintained the original thermal and chemical properties of polyimide contributing to their homogeneity. The presence of uniformly dispersed aerogel, the high-thermal decomposition and glass transition temperature of the PI–PIA sample films were confirmed by field emission scanning electron microscope, TGA and DSC analysis. The FE-SEM image of the PI–PIA film samples indicates that the PIA particles were well-dispersed in the film and retained their spherical shape.
- Jinyoung Kim
- Jinuk Kwon
- Haksoo Han
