Table 1 Damage survey performed on the Bala Shanghaya PLM before restoration

From: Scientific restoration of engraved palm leaf manuscripts

No.

Area of Damage

Location of Damage

Main Types of Damage

Damage Assessment

1#

30%

Periphery of the leaf

Staining, Missing Fragments, Fraying Fibers, Tearing, Wear of Holes

severe damage

2#

10%

Periphery of the leaf

Staining, Missing Fragments, Fraying Fibers, Wear of Holes

moderate damage

3#

10%

Left and right ends of the leaf

Staining, Missing Fragments, Wear of Holes

moderate damage

4#

10%

Left and right ends of the leaf

Staining, Missing Fragments, Fraying Fibers, Wear of Holes

moderate damage

5#

5%

Left and right ends of the leaf

Staining, Missing Fragments, Wear of Holes

moderate damage

6#

5%

Periphery of the leaf

Staining, Missing Fragments, Fraying Fibers, Wear of Holes

minor damage

7#

2%

Left and right ends of the leaf

Staining, Missing Fragments, Wear of Holes

minor damage

8#

2%

Left and right ends of the leaf

Staining, Missing Fragments, Fraying Fibers, Wear of Holes

minor damage

9#

2%

Left and right ends of the leaf

Staining, Missing Fragments, Fraying Fibers, Wear of Holes

minor damage

10#

5%

Left and right ends of the leaf

Staining, Missing Fragments, Wear of Holes

minor damage