Fig. 16: Scaling trends for bandwidth, cost, and energy efficiency in datacom and telecom interconnects.

In (a), a plot showing different switch system architectures with varying levels of electronic-photonic integration at the package level ranging from pluggable optics to 3D CPO²⁴² (reproduced with permission from SNCSC). In (b), a plot representing the change in scaling caused by the introduction of integrated, flip-chip optical I/O. The solid blue line shows the exponential increase in commercial switch package bandwidth which has occurred over the past decade due to pluggable transceiver systems^235,375,376. The dotted purple line shows projections over next decade using the scaling trend from CPO. The right axis signifies this improvement in package bandwidth has been accompanied by an improvement in the cost per bit (per second). The top axis signifies that each successive improvement in switch package bandwidth also requires a more advanced technology node to scale ASIC performance. The callouts highlight the manufacturers who have successfully commercialized CPO systems^{377,378,379,380,381}. The hatched pink circle demonstrates how the adoption of flip-chip optical I/O not only continues exponential scaling, but provides an increase in scaling rate which can dramatically accelerate the development of switches with >1 Pbps package I/O bandwidth