Fig. 3: Alignment techniques in fiber-to-chip assembly in integrated photonics.
From: Advances in waveguide to waveguide couplers for 3D integrated photonic packaging
In (a), active alignment of fiber to chip, or chip to chip, is shown with the required alignment loopbacks. In (b), passive assembly using only machine vision with alignment features is shown. In (c), a standard SMF in a V-groove array is shown compared to a standard single mode SOI waveguide
