Fig. 4: Techniques for integrating separate material platforms in integrated photonics.
From: Advances in waveguide to waveguide couplers for 3D integrated photonic packaging
In (a), the hybrid bonding of PICs from a few example material platforms is shown. The devices from those different material platforms can also be integrated using other pick-and-place methods such as μ-TP in (b). The devices can also be integrated in the FEOL using wafer bonding (i.e., heterogeneous integration) as in (c) or epitaxial growth (i.e., monolithic integration) as in (d)
