Table 3 Summary of inter-chip grating coupler devices

From: Advances in waveguide to waveguide couplers for 3D integrated photonic packaging

Package

Period (nm)

IL (dB)

Pol.

1-dB Toler. (μm)

1-dB BW (nm)

L × W (μm)

Thru.

Process

Ref.

    

Lateral

Vertical

     

SOI to SOI

586

2.8

/

± 2

/

± 15 (1543)

40 × 25

Parallel

Standard

323

SOI to SOI

632

6.0

/

±3

/

± 40 (1550)

10 × 10a

Parallel

Standard

101

SOI to SOI

630

8.0

/

±1.5

± 0.2

<± 6 (1550)

10 × 10

Parallel

Standard

324

SOI to SOIb

820 (along) 390 (lateral)

6.02

/

/

/

±5 (1560)

20.5 × 13

Parallel

Custom

325,326

SOI to SiNb

600 (Si) 1000 (SiN)

2.03

TE

± 0.25

± 0.1

<10 (1470)

12 × 18

Parallel

Custom

126

SiN to SiN

930

3.87

/

/

/

±100 (1550)

25.79 × 25.79

Parallel

Standard

124

SOI to SOI

/

4.0

/

± 2

/

< ± 10 (1310)

/

Parallel

Standard

100

a-Si to a-Sib

640

0.81

TE

/

>4

30 (1570–1600)

12 × 5

Parallel

Custom

127,327,328,329,330,331

SOI to SOI

/

5.9

/

± 2.25

±1

< ± 7 (1505)

/

Parallel

Standard

332

SOI to SOI (no reflector)

534

4.8

/

± 2.44

<0.25

± 42.5 (1310)

15 × 15

Parallel

Standard

128

SOI to SOI (reflector)

 

0.4

 

± 4.53

<0.1

± 17.5 (1310)

  

New

 

SOI to SOI

528

0.94

/

/

/

21 (1539–1560)

20 × 20

Parallel

Standard

102

  1. The bold values indicate that only simulation results were reported
  2. BW bandwidth, / not reported
  3. aEstimated based on reported MFD
  4. bIntra-chip coupling