Table 6 Summary of III-V intra-chip and inter-chip evanescent couplers in chronological order of publication date
From: Advances in waveguide to waveguide couplers for 3D integrated photonic packaging
Package | Taper design | IL (dB) | Pol. | 1-dB Toler. (μm) | 1-dB BW (nm) | L × W (μm) | Thru. | Process | Ref. | |
|---|---|---|---|---|---|---|---|---|---|---|
| Â | Â | Â | Â | Lateral | Vertical | Â | Â | Â | Â | Â |
InGaAsP to InPa | Multistage | 0.46 | / | / | / | / (1550) | 310 × 9 | Parallel | Standard | |
InGaAsP to InPa | Segmented | 0.18 | TE | / | / | / (1550) | 570 × 3 | Parallel | Standard | |
InGaAsP to InPa | Segmented | 0.2 | TE/TM | / | / | / (1550) | 40 × 3.4 | Parallel | Standard | |
InP to SOIa | Segmented | 0.2 | / | / | / | / (1590) | 180 × 1.7 | Parallel | New | |
AlGaInAs to SOIa | Multistage, resonant | 0.02 | / | > ± 0.2 | >1 | > ± 100 (1550) | 19 × 3 | Parallel | New | |
GaAs to SiNa | Linear | 0.47 | TE | / | / | 400 (900–1300) | 20 × 0.6 | Parallel | New | |
AlGaInAs to InPa | Segmented, resonant | 0.18 | TE | < ± 0.5 | / | 175 (1225–1400) | 55 × 2 | Parallel | Standard | |
SOI to LiNbO3a | Linear | 0.19 | / | / | / | / (1550) | 150 × 1 | Parallel | New | |
InGaAsP to SiN | Multistage | 0.32 | / | ± 1 | / | 20 (1560–1580) | 384 × 3 | Parallel | Custom | |
AlGaInAs to SOI | Nonlinear | 0.3 | / | ± 1.2 ± 0.35°(twist) | / | 20 (1550–1570) | 225 × 3 | Parallel | Custom | |
AlGaInAs to SOIa | Multistage, resonant | 0.08 | / | / | / | > ± 50 (1550) | 5 × 2 | Parallel | New | |
AlGaInAs to SOI | Segmented | 0.09 | / | ± 1.1 | >0.12 | 400 (1400–1800) | 87 × 3.35 | Parallel | Custom | |
