Table 8 Summary of optical wirebonding or similarly categorized techniques
From: Advances in waveguide to waveguide couplers for 3D integrated photonic packaging
Package | Technology | Thru. (sec/link) | IL (dB) | 1-dB BW (nm) | L × W × H (μm) | Process | Ref. |
|---|---|---|---|---|---|---|---|
SOI to SOI | PWB | 30–300 | 1.6 | >300 (1280–1580) | 2 (W) | New | |
Polymer to polymer | U-link | / | 4.05 to 6.36a 0.56 to 3.39b | / (850) | (200–900) × (30–50) | New | |
SiN to SiN | 3D ULI | 400 | >5.6c | / (1550) | 10 × 5 × 50,000 | New | |
MMF to SMF | 3D ULI | 200 | 0.6 | 160 (1480–1640) | 9 × 9 × 20,000 | New | |
Paralyne C to SMF | Flexible paralyne | / | / | / (450–680) | 30 × 5 (W × H) | New | |
SOI to SOI | DOW | 30 | 5.8 | <10 (1590) | 20 × 11 × 300 | Custom | |
IOX to IOX | SmartPrint | / | 6.08 | / (1310) | 2000 × 3 | Standard | |
Polymer to SMF | SCRIBE | 75–244 | 0.45 | > ± 100 (1550) | 25 × 25 | New |
