Fig. 10: MCFA device fabrication.

a Schematic of the COC LOC fabrication process: (i) clamping and plasticization, (ii) molding, (iii) LOC ejection, (iv) Solvent bonding using thin COC film, and (v) Solvent bonded MCFA lab chip. b Magnified image of the fabricated aluminum micro-mold on a 3-inch aluminum wafer and c Injection-molded MCFA lab chip on COC