Fig. 7: Fabrication process.

Fabrication flow of the MEMS accelerometers: a Backside etching using DRIE to define the backside trenches. b Front-side DRIE to pattern the device features, release holes, and front-side trenches. c Three release regions, namely, the (i) device, (ii) handle wafer block release features, and (iii) dicing features, are etched consecutively by vapor phase hydrofluoric acid. d Device separation after release26