Fig. 2: Fabrication process flow of the microfluidic device. | Microsystems & Nanoengineering

Fig. 2: Fabrication process flow of the microfluidic device.

From: Design and fabrication of a vigorous “cavitation-on-a-chip” device with a multiple microchannel configuration

Fig. 2

a Photoresist casting on a silicon dioxide-coated wafer. b Maskless lithography for channel design. c SiO2 etching, d resist stripping, e second lithography to open the inlet–outlet and pressure ports. f DRIE for Si etching. g Photoresist stripping. h Ti and Al coating to protect the wafer as well as etching and second DRIE for etching through the wafer to open inlets, outlets, and pressure ports. i Wet etching of Al. j Wet etching of Ti. k Wet etching of SiO2. l Anodic bonding of the substrate to glass after etching the silicon dioxide layer completely.

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