Fig. 4: Sample Test Chip and Superhydrophobic Coating. | Microsystems & Nanoengineering

Fig. 4: Sample Test Chip and Superhydrophobic Coating.

From: Leakage pressures for gasketless superhydrophobic fluid interconnects for modular lab-on-a-chip systems

Fig. 4

a An assembled chip assembly without the superhydrophobic surface for visual clarity. The interconnect assembly features b a pair of alignment standards, c three v-groove/ball bearing passive kinematic alignment structures, and d concentric 750 μm diameter injection-molded through-hole with tool mark to measure alignment. e Top view of Hydrobead-P on a COC sample chip imaged using a scanning electron microscope (SEM) (FEI Quanta3d FEG, Helios Nanolab, Hillsboro, OR), sputter-coated with 80 nm of platinum. f Static contact angle measurement of 152° using the sessile drop technique with a 5–6 μL droplet on a VCA Optima (Billerica, MA). g Picture of the water droplet on Hydrobead-P-coated COC sample chip.

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