Fig. 2: Fabrication procedures for the microfluidic neural interface. | Microsystems & Nanoengineering

Fig. 2: Fabrication procedures for the microfluidic neural interface.

From: A 3D flexible neural interface based on a microfluidic interconnection cable capable of chemical delivery

Fig. 2

a Processes used to fabricate the FPMA and a SEM image of the fabricated FPMA. b Processes used to fabricate the µFIC: (b-i) deposition of a sacrificial layer and the bottom PPX-C layer, (b-ii) patterning of conductive lines and pads, (b-iii) insulation of conductive patterns by the second PPX-C layer and opening of the inlet of the microfluidic channel using RIE, (b-iv) PR patterning and reflow, and deposition of the third PPX-C layer, (b-v) RIE to open the outlet of the microfluidic channel and the connection pads, (b-vi) release from the wafer and removal of the PR that filled the microfluidic channel. The completed structure of the µFIC is illustrated in (b-vi), along with the optical image of the µFIC in (b-vii). (c-i) to (c-iii) Processes to integrate the FPMA, µFIC, and reservoir. (c-iv) Fully assembled microfluidic neural interface consisting of the μFIC, FPMA, reservoir, and FPCB

Back to article page