Fig. 2: Schematic illustration and images corresponding to steps for fabricating microneedles bearing microwell sensors.

a, b Steps for fabricating microwell sensors, ablating and releasing them from the substrate using an excimer laser, and packaging with connectors. Images showing c microscopic image of wafer-level fabricated sensors, (d) sensors released from the wafer after laser micromachining, (e) an overview of a packaged sensing platform, and (f) close view of tip and sensing region with an array comprising 25 individual microwells