Fig. 5: Fabrication process.
From: Design of a large-range rotary microgripper with freeform geometries using a genetic algorithm
Fabrication flow of the MEMS devices: a Backside etching using DRIE to define the backside trenches. b Front side DRIE to pattern the device features, release holes, and front side trenches. c Three release regions, namely, (i) device, (ii) handle wafer block release features, and (iii) dicing features, were etched consecutively by hydrofluoric acid in the vapor phase. d Device separation after release26. e Image of the wafer grid of step (f) (the solid area resulting from a lithography fault). f Image of the released devices. (I) The front image of the released device, (II) back image of the released device, and (III) released “handle wafer blocks”
