Fig. 5: Thin-film aluminum sputtering sealing results.
From: Design, fabrication, characterization and reliability study of CMOS-MEMS Lorentz-force magnetometers
a XY device before sealing. b Z device before sealing. c Sealed device on wafer. d XY device after 3.5 μm sealing. e Z device after 3.5 μm sealing. f Sealed device on wafer: FIB cut.
