Table 1 Summary of different microstructures and their fabrication methods and pressure sensing performance
From: Flexible pressure sensors with ultrahigh stress tolerance enabled by periodic microslits
Ref. | Microstructure type | Preparation methods | Sensing range | ||
|---|---|---|---|---|---|
Experimentally/Maximum (kPa) | Theoretical maximum (MPa) | ||||
Fingerprint-microstructure | Laser manufacturing & Magnetron sputtering & Dipping | 0–4.5 | 4.5 | – | |
Strip-shaped bulges | Demolding from leaves & Chemical vapor deposition & Film transfer and conformal covering | 0–5.8 | 5.8 | – | |
Multistage ridges | Demolding from leaves & Thermally evaporating | 0–7 | 7 | – | |
Tentacle-like conical micropillars | Laser-engraving & Scratch coating & Demolding | 0–23 | 23 | – | |
Micro Cone Array | Two-step demolding process from leaves & Spray-coating | 0.2–25 | 25 | – | |
Bionic hierarchical structure | Demolding from abrasive papers & Depositing | 0–90 | 90 | – | |
Microdome | Two-step demolding process from rose petal & Sputtering | 0.058–98.7 | 98.7 | – | |
Pollen-shaped | Two-step demolding process from pollen & Drop-casting | 0–218 | 218 | – | |
Hemispherical arrays and gradient pores | Four-step pressing & Demolding & Removing the sacrificial template | 0–400 | 400 | – | |
This work | Microslits | Screen printing | 0–400 | 400 | 2.477 |
