Fig. 2: Deposition results of Cases A and B | Microsystems & Nanoengineering

Fig. 2: Deposition results of Cases A and B

From: An ultra-deep TSV technique enabled by the dual catalysis-based electroless plating of combined barrier and seed layers

Fig. 2

a SEM images of the Ni ELP results of Case A at the (I) via top and (II) via bottom. b Ni ELP results of Case B after performing ultrasound treatment with ultrasound power and pulse duty cycle values of 300 W and 1 s/10 s, respectively. c, d Magnified images of the via bottoms for Case A and B, respectively, showing the distributions and morphologies of the deposited Ni particles

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