Fig. 2 | Microsystems & Nanoengineering

Fig. 2

From: Thermocouple-integrated resonant microcantilever for on-chip thermogravimetric (TG) and differential thermal analysis (DTA) dual characterization applications

Fig. 2

Structure and finite element simulation results of the resonant cantilever a 3D model of the cantilever illustrating its thermocouple, sample-loading area, and integrated heater. b The temperature distribution simulation results are obtained by considering key factors such as electrical heating, heat transfer, and air convection. c Simulation results show the hindering role of the thermal isolation window on heat conduction. d Simulation results of the temperature of the hot junction show good uniformity (variation within ±1%)

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