Fig. 5 | Microsystems & Nanoengineering

Fig. 5

From: Thermocouple-integrated resonant microcantilever for on-chip thermogravimetric (TG) and differential thermal analysis (DTA) dual characterization applications

Fig. 5

Test results for the thermal properties of microcantilevers a The temperature at the hot junction is measured under different heating voltages, and the result is in agreement with the simulation. b The output voltage of the thermocouple at various heating powers indicates a high power response of 6.1 V/W. c The hot junction output voltage vs. temperature shows a temperature response of 0.73 mV/°C. d The output voltage noise of the integrated thermocouples generated by the test circuit. e The relationship between the heating voltage and the heating resistance indicates that the TCR is 0.0014/°C

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