Fig. 5: Sensor leadless package and thermal stress analysis. | Microsystems & Nanoengineering

Fig. 5: Sensor leadless package and thermal stress analysis.

From: Development of leadless packaged heavily doped N-type 4H-SiC pressure sensor family for harsh environments

Fig. 5: Sensor leadless package and thermal stress analysis.The alt text for this image may have been generated using AI.

a Profile diagram of 4H-SiC pressure sensor leadless package structure. The low-stress connections between the components of b SiC pressure sensor chip and SiC shim; c SiC shim and AlN header; d external pins and SiC sensor chip pads. e The thermal stress distribution of the leadless package sensor structure and the flip-chip SiC sensor surface. f Thermal stress distribution along the central line path on the of the sensor surface within the package

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