Fig. 1: 3-T and 7-T NEM switch designs and integration in SOI foundry platform. | Microsystems & Nanoengineering

Fig. 1: 3-T and 7-T NEM switch designs and integration in SOI foundry platform.

From: Volatile and non-volatile nano-electromechanical switches fabricated in a CMOS-compatible silicon-on-insulator foundry process

Fig. 1: 3-T and 7-T NEM switch designs and integration in SOI foundry platform.

a 3D illustration of the 3-T and 7-T NEM switches embedded in the SOI foundry platform. b Schematic cross-section of the manufacturing process: Steps (i)–(iii) are performed as part of the iSiPP50G foundry process at IMEC26. Steps (iv) and (v) are custom post-processing steps to realize the suspended and movable NEM switches. c Photograph of a 100-mm diameter wafer, prior to dicing. d Microscope image of the suspended 3-T and 7-T NEM switches placed inside the NEM cavities, along with metal interconnect routings that electrically connect the switches to the bond pads

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