Fig. 5: Electromechanical performance and structural validation of the MSFS. | Microsystems & Nanoengineering

Fig. 5: Electromechanical performance and structural validation of the MSFS.

From: Micro-spring force sensors using conductive photosensitive resin fabricated via two-photon polymerization

Fig. 5: Electromechanical performance and structural validation of the MSFS.

a–l Progressive deformation of the MSFS under applied force: (a, c, e, g, i, k) simulation results and (b, d, f, h, j, l) corresponding optical microscopy images captured at applied forces of 0, 50, 100, 150, 200, 250, and 300 \({\rm{\mu }}{\rm{N}}\), respectively. m Simulation and experimental displacement-resistance curves. n Force-resistance response curves of MSFSs with and without MXene, highlighting the critical role of MXene in conductivity enhancement. o Force-resistance response of the MSFS at 1, 15, and 30 days. p Relative resistance changes versus strain curve. q 3D surface morphology map of the MSFS. Scale bar: 100 µm

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