Fig. 3: Molecular dynamics simulation results for nanoindentation of polycrystalline copper: loading–unloading curve. | Microsystems & Nanoengineering

Fig. 3: Molecular dynamics simulation results for nanoindentation of polycrystalline copper: loading–unloading curve.

From: Long-term high-temperature aging mechanism of copper-metallized through-glass vias: a combined nanoindentation test and hybrid Potts-phase field simulation study

Fig. 3

a the 3 nm grain-size model; b the 4 nm grain-size model; c the 5 nm grain-size model. d force versus indentation depth for different grain sizes. e simulated hardness and elastic modulus as a function of grain size

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