Fig. 4: Hybrid Potts–Phase Field model simulations and electrical performance of TGV–Cu from 0 to 1008 hours. | Microsystems & Nanoengineering

Fig. 4: Hybrid Potts–Phase Field model simulations and electrical performance of TGV–Cu from 0 to 1008 hours.

From: Long-term high-temperature aging mechanism of copper-metallized through-glass vias: a combined nanoindentation test and hybrid Potts-phase field simulation study

Fig. 4

a simulated microstructure evolution during grain growth (units in μm); b Comparison of experimental and simulated average grain size; c Simulated evolution of von Mises stress distribution (units in μm); d Total free energy of the system; e Simulated evolution of elastic energy during grain growth (units in μm); f I–V measurement results of TGV–Cu samples

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