Fig. 5: Assembly of full-color Micro-LEDs on a backplane. | Microsystems & Nanoengineering

Fig. 5: Assembly of full-color Micro-LEDs on a backplane.

From: Heterogeneous integration of micro-LEDs via multiple simultaneous transfer and bonding

Fig. 5: Assembly of full-color Micro-LEDs on a backplane.The alternative text for this image may have been generated using AI.

a Schematic illustration of integrating RGB Micro-LEDs with a display backplane via the multiple SITRAB technology. b OM image of the red, green, and blue Micro-LEDs that were transferred onto the SITRAB adhesive-coated backplane at a constant pitch of 324 µm after three applications of the SITRAB process. The inset shows that the differently-colored Micro-LEDs were arranged at a constant spacing of 30 µm in a unit pixel. c Tilted (left) and cross-sectional (right) SEM images of the red, green, and blue Micro-LEDs that were integrated with the SITRAB adhesive-coated backplane after multiple SITRAB processes. d Photograph of the SITRAB-based full-color Micro-LED display emitting a white light. e OM image of the RGB Micro-LEDs that stably operated in the SITRAB-based full-color Micro-LED display. The injection current was 30 mA

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