Fig. 2
Hierarchical depiction of the fabrication of crack-defined break junctions on a wafer scale. Optical and SEM images of fabricated crack-defined break junctions (CDBJ) depicted in a range from the nano-scale (sub-3 nm gaps) to the macro-scale (100 mm diameter wafer). A total of 780,000 bridge structures were fabricated and released simultaneously using only conventional wafer-scale processes on the 100 mm diameter wafer. Upon cracking, each bridge subsequently exerted a defined pulling action on the section of gold located above the crack-line, thereby forming hundreds of thousands of CDBJs in a massively parallel fashion on wafer-scale. Scale bar is 30 µm for the “electrically probable” CDBJ, 20 µm for the “high-density array” of CDBJs, and 50 nm for the CDBJ featuring a sub-3 nm gap
