Fig. 6 | Nature Communications

Fig. 6

From: Programmable terahertz chip-scale sensing interface with direct digital reconfiguration at sub-wavelength scales

Fig. 6

The chip photo and the packaged system. a The chip is packaged on a printed circuit board supported by a silicon wafer at the back. A high-resistivity silicon lens abuts the back of the silicon wafer to enable reception of the THz waves from the backside. b The chip is implemented in an industry standard 65-nm CMOS process and measures 2 mm × 1 mm in dimension

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