Fig. 2
From: Integrated multilayer stretchable printed circuit boards paving the way for deformable active matrix
Second steps to realize integrated stretchable printed circuit boards. Schematic of silicone encapsulation of the device on hard carrier a. A photograph of the detachment process of the device layer from the hard carrier while the device is under operation (b) and functionality test of the final device in EcoFlex (c). Device in rubber matrix: Photograph of a single pixel of the active matrix encapsulated in EcoFlex showing a transistor and a LED (d). SEM image of a crossing of two metal layers in EcoFlex (e) and a VIA lifted off from the silicone substrate connecting two metal tracks (f)
