Fig. 3: Comprehension of oxygen-rich interface induced reversible stripping/plating process.

a Relative SbO₂⁻ absorption energy profiles of the CS surface with different functional groups. b Electroplating curve of the Sb on the substrates at 20 mA cm⁻² with a fixed charging capacity of 0.47 mA h cm⁻². c Illustration of the ion distribution during the plating process of CS and FCS. The arrows indicate the direction of SbO₂⁻ diffusion. d The plating mechanism on the substrate with/without the functional interface induced.