Fig. 1: High-performance thermal interface based on self-assembled boron arsenide (s-BAs) to enhance heat dissipation. | Nature Communications

Fig. 1: High-performance thermal interface based on self-assembled boron arsenide (s-BAs) to enhance heat dissipation.

From: Flexible thermal interface based on self-assembled boron arsenide for high-performance thermal management

Fig. 1

a Schematic illustration of a typical thermal interface applied in electronic packaging. Heat dissipation from the chip to heat sink via the thermal interface, unusually limited by the resulting thermal boundary resistance (TBR)33. ΔT is the temperature drop and Q is the heat flux across the interface. b Performance comparison of s-BAs vs. the state-of-the-art. Arrow pointing to the bottom left indicates the design goal of high-performance thermal interfaces to achieve both low elastic modulus and low thermal resistivity (i.e., high κ). c Schematic of the zinc-blende crystal structure of cubic BAs and its high-resolution TEM image showing atomically resolved lattices. The arrow indicates the crystal direction of (202). d Thermal conductivity distribution of different materials, including typical fillers.

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